Intel Reveals New Product And Innovations Roadmap Up Introduces New Ribbonfet Process
Firstly and moving beyond its 10nm SuperFin process, the naming convention of Intel’s next several die lithography will be ditching the “nm” reference. At least, that seems to be the case for the next three generations. As such, these process nodes will simply be known as Intel 7, Intel 4, and Intel 3. As per the official fluff, Intel 7 is what’s next on the roadmap, after the chipmaker’s current 10nm has run its course on the market....